GaSonic Aura 1000  Applications
Photoresist Stripping

• High dose implant (As+, B+, P+)
• Post-polysilicon etch
• Post-metal etch
• Post-oxide etch
• Rework

Controlled Resist Removal

• Post-develop descum (pre-etch)
• Dry/wet process capability
• Resist planarization
• Uniformity capability (5% 1s)

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Allwin21 Corp. can also provide  advanced Equip Robot transfer wafer technology , AW Control Software and Superior Temperature Control Technology  to upgrade the refurbished Gasonics Aura 1000 which provides the following significant advantages

• Use Equip robot wafer transfer instead of the index of the original, which will decrease the down time and low the wafer damage, particles greatly
• Pentium PC computer equipped either DOS Windows
• Interface control board with parallel connectors between PC computer and the Aura-1000 system
• New 16 bits A/D measurement system to replace original 12 bits A/D system to improve the accuracy of the measurements of gas flow, vacuum pressure, EOP, temperature of the wafer, etc. to improve the repeatability of the Asher process.
• New 14 bits D/A system to replace original old 8 bits D/A to improve the accuracy of the set point of the vacuum pressure, gas flow, etc.
• Add new RTP system to get more accuracy temperature control to improve the repeatability of the process. The new RTP system includes(1)New lamp control system with new special solid-state relay control system. It is similar to the oven control system of the RTP machine;(2)New zero crossing detects system. It is similar to the zero crossing detect of the RTP machine.(3)K-type thermocouple system with vacuum feed-through and amplifier to measure the temperature of the wafer. The thermocouple is touching the backside of the wafer directly. The feed-through is put on the front door, which is good when the wafer heated at 450 degree C.(4)Replace the center lamp of the system to be the same high power as the side one to speed up the heat speed and improve the uniformity of the asher and descum process.
• User-friendly recipe editor with gas flow set point, vacuum pressure set point, RF on or off set up, temperature setup etc.
• New GUI interface with curves display of the temperature, vacuum pressure, gas flow, RF status, EOP signal etc. during the process.
• Saved all process data on the local hard disk and send data to the server if it is needed (option).
• Saved all operation function, date, time and error message on the lot file.
• Wafer ID reading function to read wafer ID and use the wafer ID for the data ID to save the process data. Data saved with 4 layers: (1) directory (say year 2003,2004), (2) lot ID, (3) Date Time or step ID, (4) wafer ID. So it is easy to trace the data.
• Bar code function for the lot ID, recipe ID selection option.
• Manual and auto process running
• System diagnostics for the quick diagnostic of the system
• Easier I/O set and checks function for the Maintenance
• RTP function with temperature control ±1~2°C accuracy from 50 to 500°C with K-type thermocouple.
• Higher through put.
• Advanced accurate temperature control to make much better repeatability
• Better uniformity duo to the center lamp has the same power as the side lamp
• All process data saved and easier for failure analyzer and process debug
• “Exposed” I/O, A/D, D/A is easier for troubleshooting and maintenance. 

Wafer handling problems with Indexer System?  Allwin21 has replaced the GaSonics Aura 1000 wafer handling system with the superior 3-axis Equipe ATM Wafer Handling Robot.  This gives the A‑1000 a much superior wafer transport system with proven reliability, higher throughput, increased MTBF and lower overall cost.  Along with fewer headaches, better peace-of-mind, and longer coffee breaks. 

Plasma Asher Stripper Descum

In semiconductor manufacturing plasma asher/stripper is the process of removing the photoresist from an etched wafer. Using a plasma source, a monatomic reactive species is generated. Oxygen or fluorine are the most common reactive species. The reactive species combines with the photoresist to form ashing which is removed with a vacuum pump.

Typically, monatomic (single atom) oxygen plasma is created by exposing oxygen gas (O2) to ionizing radiation. At the same time, many free radicals are formed which could damage the wafer. Newer, smaller circuitry is increasingly susceptible to these particles. Originally, plasma was generated in the process chamber, but as the need to get rid of free radicals has increased, many machines now use a downstream plasma configuration, where plasma is formed remotely and channeled to the wafer. This allows electrically charged particles time to recombine before they reach the wafer surface, and prevents damage to the wafer surface.

Monatomic oxygen is electrically neutral and although it does recombine during the channeling, it does so at a slower rate than the positively or negatively charged free radicals, which attract one another. Effectively, this means that when all of the free radicals have recombined, there is still a portion of the active species available for process. Because a large portion of the active specie is lost to recombination, process times may take longer. To some extent, these longer process times can be mitigated by increasing the temperature of the reaction area.

Allwin21 Corp can provide the following refurbished plasma asher/descum equipment.

• Refurbished Matrix 105
• Refurbished Matrix 205 
• Refurbished Matrix 10
• Refurbished Gasonics Aura 1000
• Refurbished Gasonics Aura 2000
• Refurbished Gasonics Aura 3010
• Refurbished Gasonics L3510
• Refurbished Branson IPC 3000
• Refurbished Branson IPC L3200